Analysis of inter-module communication technologies in single-board multiprocessor systems

A.V. Smirnov

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Abstract. Multiprocessor systems are extensively used for scientific computing, yet their efficiency depends significantly on the mechanisms of inter-module interaction.
Aim. The study aims to review and analyze inter-module communication technologies in single-board multiprocessor systems, identifying their development trends, application scopes, and limitations.
Results. This paper provides a comprehensive analysis of the current state and development trends of single-board computing systems. It also includes a detailed benchmark of communication models and protocols designed for efficient interconnection between single-board computing systems. Further research on this topic is also described.
Conclusion. The analysis confirms that the extensive variety of processor architectures and intermodule communication technologies does not allow for a single universal solution. The selection of a specific solution relies on numerous factors, such as target latency, throughput, and network security, and invariably involves achieving a compromise for a given application.

Keywords: inter-module communication, multiprocessor systems, single-board computing systems

For citation. Smirnov A.V. Analysis of inter-module communication technologies in single-board multiprocessor systems. News of the Kabardino-Balkarian Scientific Center of RAS. 2026. Vol. 28. No. 3. Pp. 84–95. DOI: 10.35330/1991-6639-2026-28-3-84-95

©   Smirnov A.V., 2026

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Information about the author

Alexander V. Smirnov, Postgraduate Student, Kaliningrad State Technical University;
1, Sovetsky prospekt, Kaliningrad, 236022, Russia;
aleksandr.smirnov@klgtu.ru, ORCID: https://orcid.org/0009-0007-3580-3814, SPIN-code: 7142-4899

Funding

The study was performed without external funding.